WL 15 Series Heating Module

Key features

• Dedicated geometry for four different 15-series board shapes
• Central column isolation shields the A17 Pro CPU and baseband area
• Magnetic snap interface onto the WL host station
• Uniform heat diffusion allows separation at low-temperature thresholds

What this is used for

• Separating layered iPhone 15-series logic boards
• Low-temperature tin melting and layer stratification
• Board preparation before chip-level repair

Who it's for

Board-level technicians separating iPhone 15-series logic boards for microsoldering work.

Manufacturer description

This WL platform handles the four different motherboard shapes in the iPhone 15 family, holding each one square while the middle-frame perimeter comes up to temperature. Its central column isolates the core of the board from the heat. That matters most on this generation because the A17 Pro CPU and the baseband components sit in the middle, exactly where uncontrolled thermal expansion does its damage. Uniform diffusion across the plate removes the cold spots that force technicians to push temperatures higher than necessary — tin melts evenly and the layers come apart at standard low-temperature thresholds. • Dedicated geometry for four different 15-series board shapes • Central column isolation shields the A17 Pro CPU and baseband area • Magnetic snap interface onto the WL host station • Uniform heat diffusion allows separation at low-temperature thresholds Compatible with: iPhone 15, iPhone 15 Plus, iPhone 15 Pro, iPhone 15 Pro Max.