WL 15 Series Heating Module

4-in-1 Dedicated Geometry: Precision CNC-machined from high-grade aluminum/synthetic graphite alloys to securely seat and align the differing motherboard shapes of the iPhone 15, 15 Plus, 15 Pro, and 15 Pro Max.Central Column Isolation: Focuses thermal energy tightly onto the logic board's middle-frame perimeter. This stops heat from flooding the central core, protecting the delicate A17 Pro CPU and baseband components from fatal thermal expansion or swelling.Magnetic Snap Interface: Integrates high-strength underlying magnets that instantly align and lock the plate onto the primary WL host station, bypassing the need for manual screws or mechanical clamps.Uniform Heat Diffusion: Prevents structural cold-spots, enabling swift tin melting and effortless layer stratification at standard low-temperature thresholds.