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HomeShopMY MR YANGMr.Yang M.Y 215°C Solder Paste 50g
Mr.Yang M.Y  215°C Solder Paste 50g

Mr.Yang M.Y 215°C Solder Paste 50g

No reviews

YCS 215°C Solder Paste 50g.

Rs 1,500

Mr.Yang M.Y 215°C Solder Paste 50g. Solder paste is powdered solder suspended in flux. You squeegee it through a stencil when reballing and place it under a…

Only 1 left in stock
Not sure it fits your repair? Ask a technician
  • Nationwide delivery
    Same-day dispatch from Peshawar before 4 PM
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YCS 215°C Solder Paste 50g.

Solder paste is powdered solder suspended in flux. You squeegee it through a stencil when reballing and place it under a component before reflow. This one melts at 215°C.

Key features

  • 215°C melting point
  • Powdered solder suspended in flux
  • Squeegee grade for stencil work

What this is used for

  • Reballing through a stencil
  • Attaching components before reflow
  • Pad rework

Who it's for

Micro-soldering technicians doing reballing and rework.

Manufacturer description

Mr.Yang M.Y 215°C Solder Paste 50g. Solder paste is powdered solder suspended in flux. You squeegee it through a stencil when reballing and place it under a component before reflow. This one melts at 215°C. • 215°C melting point • Powdered solder suspended in flux • Squeegee grade for stencil work Compatible with: BGA reballing stencils and phone board rework.

Repair guides for this tool

  • TutorialHow to Reball a BGA Chip: Step-by-Step Guide
  • Buying guideBest Microscope for Phone Repair (2026 Buyer's Guide)

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