Which iPhone models does this kit cover?

CPU reballing from iPhone X through iPhone 17 Pro Max.

Precision positioning moulds and reballing stencils for accurate solder ball placement.

Why do the positioning moulds matter?

The mould holds the chip square against the stencil, which is what keeps solder ball height even across the array.

Mr.Yang M.Y X-17 CPU Reballing Kit for iPhone X to 17 Pro Max Motherboard Repair

Name: Mr.Yang M.Y X-17 CPU Reballing Kit for iPhone X to 17 Pro Max Motherboard Repair
Brand: YCS (Mr.Yang)
Price: 16000 PKR
Availability: InStock

No reviews

A complete BGA reballing kit for iPhone CPUs, covering an unusually wide generation span — iPhone X through 17 Pro Max — from a single set.

Rs 16,000

A complete BGA reballing kit for iPhone CPUs, covering an unusually wide generation span — iPhone X through 17 Pro Max — from a single set. It ships with…

Only 2 left in stock

Quantity

Not sure it fits your repair? Ask a technician

Nationwide delivery
Same-day dispatch from Peshawar before 4 PM
Authentic parts
100% genuine, sourced from manufacturers
7-day returns
No-questions return on most items

A complete BGA reballing kit for iPhone CPUs, covering an unusually wide generation span — iPhone X through 17 Pro Max — from a single set.

It ships with precision positioning moulds as well as stencils. The mould is what holds the chip square to the stencil; without it, ball height drifts and the CPU will not seat reliably.

Key features

Covers iPhone X through iPhone 17 Pro Max
Includes precision positioning moulds and reballing stencils
For CPU reballing and IC replacement

What this is used for

iPhone CPU reballing
IC replacement and chip-level board repair

Who it's for

Advanced microsoldering technicians doing CPU reballing. Assumes hot air, microscope and reballing experience.

Where it fits in the repair

CPU removal, pad cleaning, seat the chip in the positioning mould, align the matching stencil, apply paste and reball, then reinstall and test.

Manufacturer description

A complete BGA reballing kit for iPhone CPUs, covering an unusually wide generation span — iPhone X through 17 Pro Max — from a single set. It ships with precision positioning moulds as well as stencils. The mould is what holds the chip square to the stencil; without it, ball height drifts and the CPU will not seat reliably. • Covers iPhone X through iPhone 17 Pro Max • Includes precision positioning moulds and reballing stencils • For CPU reballing and IC replacement Compatible with: iPhone X through iPhone 17 Pro Max.